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2oz HDI PCB with 0.07mm Laser Drill, 0.04mm Line Width, and 0.3mm BGA Pitch for High Density Interconnect Applications

HDI PCB Board
2026-02-06
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2oz HDI PCB Manufacturing Our 2oz HDI Printed Circuit Boards (High Density Interconnect) deliver ultra-fine features with 0.04mm trace/space and 0.07mm laser drill capability. Ideal for consumer ... View More
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2oz HDI PCB with 0.07mm Laser Drill, 0.04mm Line Width, and 0.3mm BGA Pitch for High Density Interconnect Applications
2oz HDI PCB with 0.07mm Laser Drill, 0.04mm Line Width, and 0.3mm BGA Pitch for High Density Interconnect Applications
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