Product Details
Place of Origin: China
Brand Name: Kingtech
Certification: GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: By quote
Packaging Details: Vacuum packing
Delivery Time: 2-7days
Payment Terms: By quote
Supply Ability: 500000 SQM per month
Min. Laser Drill Hole Size: |
0.07mm |
BGA Pitch: |
0.3mm |
Min. Line Widthe/space: |
0.04mm/ 0.04mm |
Copper Thickness: |
1/3-8 |
Vias Aspect Ratio: |
16:1 |
Warpage: |
≤0.4% |
Min. Mechanical Drill Hole Size: |
0.1mm |
Blind Hole Aspect Ratio: |
1:1 |
Min. Laser Drill Hole Size: |
0.07mm |
BGA Pitch: |
0.3mm |
Min. Line Widthe/space: |
0.04mm/ 0.04mm |
Copper Thickness: |
1/3-8 |
Vias Aspect Ratio: |
16:1 |
Warpage: |
≤0.4% |
Min. Mechanical Drill Hole Size: |
0.1mm |
Blind Hole Aspect Ratio: |
1:1 |
| Product Attribute | Technical Parameter |
|---|---|
| Impedance Control | ±8% |
| Board Thickness | 0.2-3.2mm |
| Min. Line width/space | 0.04mm/ 0.04mm |
| Min. Core Thickness | 0.05 |
| Min. Mechanical Drill Hole size | 0.1mm |
| Warpage | ≤0.4% |
| Blind Hole Aspect Ratio | 1:1 |
| Misalignment of layers | ± 0.06 |
| Min. Laser Drill Hole size | 0.07mm |
| Max. Board size | 540*620 |