Six Layer Electronic PCB Board 1.0mm Thin FR4 Immersion Gold Red Solder Mask 0.075mm Line Width

Six Layer 1.0mm Electronic PCB Board for Compact Multilayer Designs

A six layer Electronic PCB Board built on 1.0mm thin FR4 with immersion gold pads and a red solder mask. The 6 layer stack up frees routing channels for dense BGA fan out and display driver layouts where a two layer board runs out of space, while the reduced 1.0mm thickness saves vertical room in slim enclosures.

Design advantages

• Six layer stack with dedicated ground and power planes for lower return path noise
• 1.0mm thin construction saves Z height in handheld and panel mount products
• Immersion gold pads stay flat for 0.35mm pitch QFN and fine pitch connectors
• 0.075mm line width and spacing supports dense signal routing between vias
• Red solder mask assists visual identification of multilayer part numbers on the line

Technical parameters

Where it fits

• Display driver and interface modules
• Portable instruments and handheld meters
• Communication gateways and IoT concentrators
• Industrial camera and sensor head boards

Process and lead time

Artwork is reviewed with a stack up proposal before tooling. Production is covered by IATF16949, ISO9001, ISO13485, ISO14001, ISO45001, AS9100D, QC080000, GJB9001C and UL systems, with 100% electrical testing and impedance coupon verification on controlled nets. Standard lead time is 7-10 working days, with vacuum packing for export.

Customization service

Layer stack, dielectric thickness and via structure can all be tailored to your design rule set. Brand Name: Kingtech. Place of Origin: China.

Support

Support includes stack up simulation, impedance modelling, coupon cross section reports and rework guidance for fine pitch assembly. Sample runs from 1 piece are accepted for design verification.