2oz Heavy Copper Electronic PCB Board High TG170 FR4 2.0mm Thick ENIG Surface Finish Blue Mask

2oz Heavy Copper Electronic PCB Board for Industrial Power Loads

This Electronic PCB Board is fabricated on high TG170 FR4 laminate with a 2.0mm finished thickness, built for industrial control cabinets, motor drive stages and switching power supplies where current carrying capacity and heat resistance are the deciding factors. Heavy 2oz copper weight raises trace ampacity and lowers I2R losses, while the ENIG surface finish keeps pad coplanarity flat for fine pitch SMT placement.

Why engineers specify this build

• 2oz finished copper weight supports higher current per trace without widening the routing
• TG170 laminate keeps the board dimensionally stable through lead-free reflow and repeated thermal cycling
• ENIG (Immersion Nickel Immersion Gold) pad finish gives a flat surface for 0.4mm pitch components and long shelf life
• Blue solder mask with white silkscreen legend improves contrast for manual inspection and rework
• Impedance control available on request for high speed signal groups

Technical parameters

Typical applications

• Industrial control and PLC carrier boards
• Motor driver and inverter power stages
• Switching mode power supply secondary boards
• Charging and battery management modules

Manufacturing and delivery

Prototype quantities from 1 piece, with tooling and production runs handled in house under GJB9001C, IATF16949, ISO13485, ISO9001, ISO14001, ISO45001, AS9100D, QC080000 and UL certified systems. Boards are electrically tested, vacuum packed with desiccant, and normally ship in 7-10 working days after artwork release.

Customization service

Send Gerber data and stack up requirements and we will return a fabrication review covering copper balance, impedance targets, panel utilization and surface finish options. Brand Name: Kingtech. Place of Origin: China.

Support

Engineering support covers DFM review before tooling, stack up consultation, impedance coupon verification and reliability test reports. After sales questions on assembly fit, solderability or rework are answered by the process engineering team.