Product Details
Place of Origin: Guangdong, China
Brand Name: Kingtech
Certification: ISO 9001:2015, RoHS, UL
Model Number: KT-MPL20
Payment & Shipping Terms
Minimum Order Quantity: 5 Pieces
Price: USD 18-62 / Piece
Packaging Details: Vacuum sealed with desiccant, anti-static interleaf, reinforced export carton
Delivery Time: 7-10 days for samples, 12-20 days for volume orders
Payment Terms: T/T, L/C, PayPal, Western Union
Supply Ability: 12000 Square Meters per Month
Dielectric: |
Metal Powder Filled Aluminum Substrate |
Layer Count: |
1-24 Layers |
Outer Copper: |
20 OZ |
Inner Copper: |
15 OZ |
Minimum Hole Size: |
0.05mm |
Thermal Conductivity: |
2.5 W/m.K |
Isolation Voltage: |
6000V DC |
Max Board Thickness: |
6.5mm |
Surface Finish: |
ENIG / OSP / Immersion Silver |
Dielectric: |
Metal Powder Filled Aluminum Substrate |
Layer Count: |
1-24 Layers |
Outer Copper: |
20 OZ |
Inner Copper: |
15 OZ |
Minimum Hole Size: |
0.05mm |
Thermal Conductivity: |
2.5 W/m.K |
Isolation Voltage: |
6000V DC |
Max Board Thickness: |
6.5mm |
Surface Finish: |
ENIG / OSP / Immersion Silver |
High bay fixtures and street light drivers live or die on heat. This metal powder based aluminium PCB board carries a 20 OZ copper plane bonded to an insulating layer filled with industrial metal powder, pulling heat out of the driver ICs and keeping lumen output stable after 50,000 hours. The 0.05mm minimum hole size lets us place the fine-pitch driver controller and current sense resistors on the same panel.
| Parameter | Specification |
|---|---|
| Dielectric | Metal powder filled aluminium substrate |
| Layer count | 1 - 24 layers |
| Outer copper | 20 OZ |
| Inner copper | 15 OZ |
| Minimum hole | 0.05mm |
| Thermal conductivity | 2.5 W/m.K |
| Isolation voltage | 6000V DC |
| Board thickness | up to 6.5mm |
| Surface finish | ENIG, OSP, immersion silver |
| Solder mask colour | White, matte black, green |
| Testing | AOI, 100% e-test, thermal shock, hipot |
| Compliance | RoHS, REACH, IPC-A-600 Class 2/3 |
LED driver modules, horticulture grow lights, UV curing arrays, high bay and stadium lighting, industrial metal powder equipment power boards, and copper metal products that need a flat heat spreading base with fine hole routing.
Substrate incoming inspection checks bond strength and dielectric thickness. After imaging we run AOI on 100% of panels, then e-test for opens and shorts, then hipot at the rated 6000V. Thermal shock cycling between -40 C and 125 C validates the microvia barrels before shipment.
We make to drawing: outline, copper weight, thermal pad apertures, connector cut-outs, silkscreen marking and panelisation. Prototype quantities start at 5 pieces so lighting designers can validate thermal performance before tooling up.
Boards are vacuum sealed with desiccant and stacked with anti-static interleaves, then packed in reinforced cartons for air or sea freight. Sample runs ship in 7-10 days.
Send your drawing and thermal target, and we will confirm the metal powder stack-up and price within one working day.