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HONGKONG KINGTECH PCB SOLUTION LIMITED
HONGKONG KINGTECH PCB SOLUTION LIMITED
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0.05mm Min Hole Metal Powder Aluminum PCB Board 20 Oz Copper For LED Driver Module

Product Details

Place of Origin: Guangdong, China

Brand Name: Kingtech

Certification: ISO 9001:2015, RoHS, UL

Model Number: KT-MPL20

Payment & Shipping Terms

Minimum Order Quantity: 5 Pieces

Price: USD 18-62 / Piece

Packaging Details: Vacuum sealed with desiccant, anti-static interleaf, reinforced export carton

Delivery Time: 7-10 days for samples, 12-20 days for volume orders

Payment Terms: T/T, L/C, PayPal, Western Union

Supply Ability: 12000 Square Meters per Month

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Specifications
Highlight:

0.05mm Min Hole Metal PCB

,

20 Oz Copper LED Circuit Board

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Metal Powder Aluminum Substrate Board

Dielectric:
Metal Powder Filled Aluminum Substrate
Layer Count:
1-24 Layers
Outer Copper:
20 OZ
Inner Copper:
15 OZ
Minimum Hole Size:
0.05mm
Thermal Conductivity:
2.5 W/m.K
Isolation Voltage:
6000V DC
Max Board Thickness:
6.5mm
Surface Finish:
ENIG / OSP / Immersion Silver
Dielectric:
Metal Powder Filled Aluminum Substrate
Layer Count:
1-24 Layers
Outer Copper:
20 OZ
Inner Copper:
15 OZ
Minimum Hole Size:
0.05mm
Thermal Conductivity:
2.5 W/m.K
Isolation Voltage:
6000V DC
Max Board Thickness:
6.5mm
Surface Finish:
ENIG / OSP / Immersion Silver
Description
0.05mm Min Hole Metal Powder Aluminum PCB Board 20 Oz Copper For LED Driver Module

0.05mm Min Hole Metal Powder Aluminum PCB Board for LED Driver Modules

High bay fixtures and street light drivers live or die on heat. This metal powder based aluminium PCB board carries a 20 OZ copper plane bonded to an insulating layer filled with industrial metal powder, pulling heat out of the driver ICs and keeping lumen output stable after 50,000 hours. The 0.05mm minimum hole size lets us place the fine-pitch driver controller and current sense resistors on the same panel.

What makes this stack-up different

  • Metal powder filled dielectric with 2.5 W/m.K through-plane conductivity
  • 20 OZ outer copper for uniform current spread across long LED strings
  • 0.05mm laser microvias that survive 3x reflow without barrel cracks
  • 1-24 layer capability with 15 OZ inner copper on the power planes
  • 6000V isolation between the LED side and the metal base
  • 6.5mm maximum thickness for mechanically loaded fixture mounts

Specification summary

ParameterSpecification
DielectricMetal powder filled aluminium substrate
Layer count1 - 24 layers
Outer copper20 OZ
Inner copper15 OZ
Minimum hole0.05mm
Thermal conductivity2.5 W/m.K
Isolation voltage6000V DC
Board thicknessup to 6.5mm
Surface finishENIG, OSP, immersion silver
Solder mask colourWhite, matte black, green
TestingAOI, 100% e-test, thermal shock, hipot
ComplianceRoHS, REACH, IPC-A-600 Class 2/3

Typical applications

LED driver modules, horticulture grow lights, UV curing arrays, high bay and stadium lighting, industrial metal powder equipment power boards, and copper metal products that need a flat heat spreading base with fine hole routing.

Process control

Substrate incoming inspection checks bond strength and dielectric thickness. After imaging we run AOI on 100% of panels, then e-test for opens and shorts, then hipot at the rated 6000V. Thermal shock cycling between -40 C and 125 C validates the microvia barrels before shipment.

Custom build

We make to drawing: outline, copper weight, thermal pad apertures, connector cut-outs, silkscreen marking and panelisation. Prototype quantities start at 5 pieces so lighting designers can validate thermal performance before tooling up.

Packaging and shipping

Boards are vacuum sealed with desiccant and stacked with anti-static interleaves, then packed in reinforced cartons for air or sea freight. Sample runs ship in 7-10 days.

Send your drawing and thermal target, and we will confirm the metal powder stack-up and price within one working day.

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