Product Details
Place of Origin: Guangdong, China
Brand Name: Kingtech
Certification: ISO 9001:2015, IATF 16949, UL
Model Number: KT-MC24H
Payment & Shipping Terms
Minimum Order Quantity: 5 Pieces
Price: USD 28-95 / Piece
Packaging Details: Vacuum packed with desiccant, anti-static foam, export grade carton with edge protection
Delivery Time: 7-10 days for samples, 15-25 days for volume orders
Payment Terms: T/T, L/C, Western Union
Supply Ability: 8000 Square Meters per Month
Layer Count: |
1-24 Layers |
Outer Copper: |
Up To 20 OZ |
Inner Copper: |
Up To 15 OZ |
Minimum Hole Size: |
0.05mm |
Withstand Voltage: |
6000V DC |
Finished Thickness: |
6.5mm Max |
Thermal Conductivity: |
2.0-3.0 W/m.K |
Surface Finish: |
ENIG / Immersion Tin / OSP |
Quality Standard: |
IPC-A-600 Class 3 |
Layer Count: |
1-24 Layers |
Outer Copper: |
Up To 20 OZ |
Inner Copper: |
Up To 15 OZ |
Minimum Hole Size: |
0.05mm |
Withstand Voltage: |
6000V DC |
Finished Thickness: |
6.5mm Max |
Thermal Conductivity: |
2.0-3.0 W/m.K |
Surface Finish: |
ENIG / Immersion Tin / OSP |
Quality Standard: |
IPC-A-600 Class 3 |
Built for traction and charger platforms that push continuous current past 400A, this 24 layer heavy copper aluminum metal PCB board pairs a 20 OZ outer copper layer with a 6.5mm finished thickness. The aluminium metal core spreads heat away from the switching devices, so IGBT and SiC modules hold their junction temperature inside a narrow band even during repeated fast-charge cycles.
| Parameter | Specification |
|---|---|
| Layer count | 1 - 24 layers |
| Base material | Aluminium metal core / copper metal products |
| Outer copper | up to 20 OZ |
| Inner copper | up to 15 OZ |
| Finished thickness | 6.5mm max |
| Minimum hole size | 0.05mm |
| Withstand voltage | 6000V DC |
| Thermal conductivity | 2.0 - 3.0 W/m.K |
| Surface finish | ENIG, immersion tin, OSP |
| Solder mask | Green, matte black, white |
| Quality standard | IPC-A-600 Class 3, IATF 16949 flow |
| Test coverage | AOI, flying probe, hipot, thermal cycling |
On-board charger stages, DC-DC converters, battery management power rails, motor inverter gate drivers and charging pile heat sinks. The heavy copper core carries the full charge current with fewer parallel paths, which simplifies the busbar layout and lowers assembly cost.
Panels are laminated in a controlled press cycle, then drilled on UV laser lines for the 0.05mm microvias. Each lot goes through AOI, flying probe electrical test, hipot at 6000V and a 100 cycle thermal shock check before packing. A first article report with cross-section photos ships with the pilot batch.
Layer count, copper weight, board outline, thermal pad windows, press-fit holes, impedance targets and marking are all made to drawing. Send Gerber plus stack-up notes and our engineering team returns a DFM review within 24 hours.
Vacuum packed with desiccant, separated by anti-static foam, shipped in export grade cartons with edge protection. Samples in 7-10 days, volume production 15-25 days depending on layer count.
Tell us your current, voltage and thickness target and we will quote the heavy copper stack-up that fits it.