Mixed Dielectric 12 Layer Multilayer PCB Board Rogers 4350B ENIG Finish For 5G Antenna Array Front End

Product Overview

The Mixed Dielectric 12 Layer Multilayer PCB Board combines Rogers 4350B high frequency laminate cores with FR4 prepreg in a hybrid stack-up, so RF signal layers keep a stable dielectric constant while the power and digital layers stay cost efficient. With ENIG finish, 0.075/0.075mm fine lines and ±5% impedance control, the board supports 5G antenna array front end modules up to 40GHz.

Design advantages of a hybrid stack

• Rogers 4350B cores (Dk 3.48 / Df 0.0037) — insertion loss 0.25dB/inch lower than pure FR4 at 28GHz, which protects antenna gain and EVM margins.
• FR4 power and digital layers — keeps 60% of the stack on standard material, reducing bare board cost by up to 35% versus an all-Rogers build.
• 12 layer 1-2-2-2-2-2-1 build — dedicated ground planes sit 0.1mm below each RF layer for tight return paths and low cross-talk between antenna elements.
• ENIG 3–6µInch finish — flat gold surface for 0.3mm pitch BGA and 0201 passives, with 12-month shelf life.
• ±5% impedance control on RF nets — verified by TDR coupon on every panel, so 50Ω and 100Ω differential lines land inside spec on first pass.

Technical Parameters

Typical applications

5G massive MIMO antenna arrays. Twelve layers allow 8 RF feed layers plus control and DC distribution in one board, keeping phase error between elements under 3°.

Radar and automotive sensing modules. The 77GHz capable laminate stack holds ±5% impedance across the operating temperature range, which keeps range resolution stable from -40°C to 125°C.

Satellite communication terminals. Low Df cores reduce feed network loss, lifting EIRP without adding amplifier gain.

Quality control

• TDR impedance coupon on 100% of production panels
• Micro-section on each lot to confirm hybrid lamination bond strength ≥1.0N/mm
• Thermal stress test 288°C / 10s, 3 passes, no delamination
• Coupon test for Dk and Df drift after 3 reflow cycles

OEM and customization

We build hybrid stack-ups from 4 to 20 layers with Rogers, Taconic or Isola high frequency cores, and support impedance modelling from your stack-up drawing. Send your Gerber files and layer stack for a DFM review within two working days.

Request your mixed dielectric stack-up quote today — RF prototypes ship in 7 working days.