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HONGKONG KINGTECH PCB SOLUTION LIMITED
HONGKONG KINGTECH PCB SOLUTION LIMITED
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6 Layer Rigid Flex PCB with 0.1mm Polyimide Core for 100K Bend Cycles in FPC Circuit Boards

Product Details

Place of Origin: Guangdong, China

Brand Name: Kingtech

Certification: ISO 9001:2015, ISO 13485, IPC-6013 Class 3, UL 94V-0

Model Number: RF-BB-6L

Payment & Shipping Terms

Minimum Order Quantity: 5 Pieces

Price: USD 8-45 / Piece

Packaging Details: Vacuum-sealed ESD bag with desiccant, stacked in export-grade corrugated carton with foam corner protection

Delivery Time: 3-5 working days for prototypes, 12-18 days for volume orders

Payment Terms: T/T,L/C,Western Union

Supply Ability: 30000 Square Meters per Month

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Specifications
Highlight:

Bookbinder Rigid Flex PCB

,

100K Bend Cycles Verified

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0.1mm Polyimide Flex Core

Layer Count:
6 Layers Rigid / 2 Layers Flex
Flex Core Thickness:
0.1mm Polyimide
Dynamic Bend Radius:
6.5mm At 100,000 Cycles
Min Trace/Space:
0.05/0.05mm
Board Thickness:
1.6mm Rigid / 0.30mm Flex Zone
Impedance Tolerance:
+/-7%
Layer Count:
6 Layers Rigid / 2 Layers Flex
Flex Core Thickness:
0.1mm Polyimide
Dynamic Bend Radius:
6.5mm At 100,000 Cycles
Min Trace/Space:
0.05/0.05mm
Board Thickness:
1.6mm Rigid / 0.30mm Flex Zone
Impedance Tolerance:
+/-7%
Description
6 Layer Rigid Flex PCB with 0.1mm Polyimide Core for 100K Bend Cycles in FPC Circuit Boards
Bookbinder Rigid-Flex PCB — Install-Once Forming, 100K Dynamic Bend Cycles

A 6-layer bookbinder rigid-flex board built for products where the PCB must be folded into a housing during assembly and then survive vibration, thermal cycling, and repeated handling. The rigid wings carry the connectors and control circuitry, while a 0.1mm polyimide tail handles routing through the hinge or cable path.

Why Bookbinder Construction

Instead of mating two rigid boards with a cable harness and two connectors, the flex tail is laminated directly into the rigid core. This removes two solder joints and one connector pair per link — exactly where field failures concentrate in handheld instruments, wearable hubs, and compact medical devices. Assembly drops the harness step, and the finished unit loses the volume that the connector pair used to occupy.

Where This Board Fits

The rigid wings are typically 1.6mm FR4 Tg170 for standard SMT reflow, while the flex zone is a single 0.1mm polyimide core with 0.05mm coverlay on both faces. In the folded state, the tail holds a static bend down to a 3mm radius and a dynamic bend of 6.5mm radius for 100,000 cycles — the range where most handheld medical and industrial scanner designs actually operate. If a product requires continuous flexing in the millions of cycles, a dedicated dynamic flex design is the better base, and we will say so before quoting.

Fabrication Data
Parameter Specification
Layer count6 layers rigid / 2 layers flex
Rigid base materialFR4 Tg170, 1.6mm, 1oz outer / 0.5oz inner copper
Flex base material0.1mm polyimide core, 0.5oz rolled annealed copper
Coverlay0.05mm polyimide film with acrylic adhesive, both sides
Min. trace / space0.05mm / 0.05mm
Min. mechanical drill0.10mm
Min. laser drill0.075mm
Flex tail width5.0mm standard (1.5mm minimum)
Static bend radius3.0mm
Dynamic bend radius6.5mm, 100,000 cycles verified
Impedance tolerance±7%
Surface finishENIG 1–3µ", hard gold 30µ" on flex fingers
Board thickness1.6mm rigid / 0.30mm flex zone
Warpage≤0.4%
Operating temperature-40 °C to +125 °C
Quality standardIPC-6013 Class 3, IPC-A-600 acceptance
Max. board size700 × 480mm panel
Process Controls That Matter on Rigid-Flex

Two failure modes decide whether a rigid-flex board survives the field: delamination at the rigid-to-flex transition, and copper fatigue at the bend.

  • Transition delamination is controlled with a controlled-depth routing step and a transition zone that keeps adhesive flow out of the bend area, with a cross-section at the transition on every first article.
  • Copper fatigue is controlled at design review: rolled annealed copper in the flex zone, traces routed perpendicular to the bend line, and hatched ground planes rather than solid pours.
Testing On Every Order
  • Flying probe electrical test on 100% of boards
  • Impedance coupons on controlled-impedance nets
  • Thermal shock at 288 °C for 10 seconds on a sampled basis
  • Bend-cycle coupon test on the flex zone for orders above 500 pieces
  • First article includes cross-section photos of the transition zone and a dimensional report
Typical Applications

Handheld patient monitors, wearable ECG patches, industrial barcode scanners, portable test instruments, miniature camera modules, and control boards that fold around a battery compartment.

Ordering

Prototype orders start from 5 pieces with 3–5 working days lead time; volume builds run 12–18 days. Send Gerber data plus a stack-up preference and we will return a DFM report within one working day, including a bend-radius check on the flex tail.

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