Product Details
Place of Origin: China
Brand Name: Kingtech
Certification: ISO 9001:2015, UL, RoHS
Model Number: MLB-4OZ-HC
Payment & Shipping Terms
Minimum Order Quantity: 5 Square Meters
Price: USD 12-55 / Piece
Packaging Details: Anti-static bag, vacuum sealed with desiccant, separated by interleaf paper, export-grade carton
Delivery Time: 5-7 working days for prototype, 12-18 working days for volume orders
Payment Terms: T/T, L/C, Western Union
Supply Ability: 15000 Square Meters per Month
Copper Weight: |
4oz (140um) Outer, 2oz Inner |
Finished Board Thickness: |
6.0mm |
Layer Count: |
8L Heavy Copper Build (2-48L Available) |
Surface Finish: |
Immersion Silver, 0.1-0.15um |
Min. Hole Size: |
0.25mm |
Max. Current Capacity: |
35A Per Trace On 4oz Layer |
Thermal Cycling: |
1000 Cycles, -40C To 150C |
Thermal Conductivity Path: |
Copper-filled Thermal Vias Under Power Stage |
Insulation Resistance: |
10^12 Ohm At 500V DC |
Solder Mask: |
Matte Green, High-Tg, 0.05mm Dam Width |
Base Material: |
FR4 TG180, High Thermal Reliability |
Application: |
Motor Drive Controller, Inverter, Charging Pile Module |
Copper Weight: |
4oz (140um) Outer, 2oz Inner |
Finished Board Thickness: |
6.0mm |
Layer Count: |
8L Heavy Copper Build (2-48L Available) |
Surface Finish: |
Immersion Silver, 0.1-0.15um |
Min. Hole Size: |
0.25mm |
Max. Current Capacity: |
35A Per Trace On 4oz Layer |
Thermal Cycling: |
1000 Cycles, -40C To 150C |
Thermal Conductivity Path: |
Copper-filled Thermal Vias Under Power Stage |
Insulation Resistance: |
10^12 Ohm At 500V DC |
Solder Mask: |
Matte Green, High-Tg, 0.05mm Dam Width |
Base Material: |
FR4 TG180, High Thermal Reliability |
Application: |
Motor Drive Controller, Inverter, Charging Pile Module |
Drive controllers fail for two reasons: copper that cannot carry the current, and laminate that cannot take the heat. This heavy copper multilayer PCB board answers both with 4oz outer layers, a 6.0mm finished thickness and Immersion Silver pads, so power stages, gate drivers and sensing circuits live on one board without hot spots or trace fusing.
| Parameter | Specification |
|---|---|
| Copper Weight | 4oz (140um) outer, 2oz inner |
| Finished Thickness | 6.0mm |
| Layer Count | 8L heavy copper, 2-48L available |
| Surface Finish | Immersion Silver 0.1-0.15um, ENIG optional |
| Min. Hole Size | 0.25mm |
| Current Capacity | Up to 35A per 4oz trace |
| Thermal Cycling | 1000 cycles, -40C to 150C |
| Insulation Resistance | 10^12 Ohm at 500V DC |
| Solder Mask | Matte green, high-Tg, 0.05mm dam |
| Base Material | FR4 TG180 |
| Max. Panel Size | 1000*600mm |
AC and servo motor drives, solar inverter power stages, EV charging pile control modules, welding equipment, elevator controllers and heavy-duty power supplies working in cabinets above 60C.
Heavy copper changes everything downstream: trace width, dielectric spacing, panelization and assembly reflow profile. Send your Gerber, copper weight per layer and thermal target and we return a manufacturability review with a corrected stackup within one business day. Copper weight from 2oz to 6oz and thickness from 1.6mm to 6.0mm are available on the same production line.
Minimum order 5 square meters, USD 12-55 per piece depending on layer count and copper weight. Monthly capacity 15000 square meters. Prototype lead time 5-7 working days, volume orders 12-18 working days. Payment by T/T, L/C or Western Union.
Need samples? Tell us your current rating, working temperature and enclosure space, and we will propose a copper build for your controller.