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HONGKONG KINGTECH PCB SOLUTION LIMITED
HONGKONG KINGTECH PCB SOLUTION LIMITED
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Heavy Copper 4oz Multilayer PCB Board 6.0mm Thick Immersion Silver For Industrial Drive Controller

Product Details

Place of Origin: China

Brand Name: Kingtech

Certification: ISO 9001:2015, UL, RoHS

Model Number: MLB-4OZ-HC

Payment & Shipping Terms

Minimum Order Quantity: 5 Square Meters

Price: USD 12-55 / Piece

Packaging Details: Anti-static bag, vacuum sealed with desiccant, separated by interleaf paper, export-grade carton

Delivery Time: 5-7 working days for prototype, 12-18 working days for volume orders

Payment Terms: T/T, L/C, Western Union

Supply Ability: 15000 Square Meters per Month

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Specifications
Highlight:

Heavy Copper 4oz Multilayer PCB

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6.0mm Thick Multilayer PCB Board

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Immersion Silver Multilayer PCB

Copper Weight:
4oz (140um) Outer, 2oz Inner
Finished Board Thickness:
6.0mm
Layer Count:
8L Heavy Copper Build (2-48L Available)
Surface Finish:
Immersion Silver, 0.1-0.15um
Min. Hole Size:
0.25mm
Max. Current Capacity:
35A Per Trace On 4oz Layer
Thermal Cycling:
1000 Cycles, -40C To 150C
Thermal Conductivity Path:
Copper-filled Thermal Vias Under Power Stage
Insulation Resistance:
10^12 Ohm At 500V DC
Solder Mask:
Matte Green, High-Tg, 0.05mm Dam Width
Base Material:
FR4 TG180, High Thermal Reliability
Application:
Motor Drive Controller, Inverter, Charging Pile Module
Copper Weight:
4oz (140um) Outer, 2oz Inner
Finished Board Thickness:
6.0mm
Layer Count:
8L Heavy Copper Build (2-48L Available)
Surface Finish:
Immersion Silver, 0.1-0.15um
Min. Hole Size:
0.25mm
Max. Current Capacity:
35A Per Trace On 4oz Layer
Thermal Cycling:
1000 Cycles, -40C To 150C
Thermal Conductivity Path:
Copper-filled Thermal Vias Under Power Stage
Insulation Resistance:
10^12 Ohm At 500V DC
Solder Mask:
Matte Green, High-Tg, 0.05mm Dam Width
Base Material:
FR4 TG180, High Thermal Reliability
Application:
Motor Drive Controller, Inverter, Charging Pile Module
Description
Heavy Copper 4oz Multilayer PCB Board 6.0mm Thick Immersion Silver For Industrial Drive Controller

Heavy Copper 4oz Multilayer PCB Board for Motor Drive Controllers

Drive controllers fail for two reasons: copper that cannot carry the current, and laminate that cannot take the heat. This heavy copper multilayer PCB board answers both with 4oz outer layers, a 6.0mm finished thickness and Immersion Silver pads, so power stages, gate drivers and sensing circuits live on one board without hot spots or trace fusing.

Built for Current, Not Just for Layout

  • 4oz outer copper (140um) carries up to 35A per trace, replacing busbars and copper bars in compact housings.
  • 6.0mm finished thickness keeps mechanical rigidity under transformer weight and connector torque.
  • Immersion Silver finish keeps a flat, solderable pad for power modules and stays stable through multiple reflow passes.
  • Copper-filled thermal vias pull heat from the MOSFET area into internal copper planes.
  • 1000 thermal cycles from -40C to 150C verified on production lots, not only on samples.

Technical Parameters

ParameterSpecification
Copper Weight4oz (140um) outer, 2oz inner
Finished Thickness6.0mm
Layer Count8L heavy copper, 2-48L available
Surface FinishImmersion Silver 0.1-0.15um, ENIG optional
Min. Hole Size0.25mm
Current CapacityUp to 35A per 4oz trace
Thermal Cycling1000 cycles, -40C to 150C
Insulation Resistance10^12 Ohm at 500V DC
Solder MaskMatte green, high-Tg, 0.05mm dam
Base MaterialFR4 TG180
Max. Panel Size1000*600mm

Typical Applications

AC and servo motor drives, solar inverter power stages, EV charging pile control modules, welding equipment, elevator controllers and heavy-duty power supplies working in cabinets above 60C.

Process Control

  • Thick copper etching with compensated trace width, verified by cross-section.
  • Multi-step lamination to avoid resin starvation around 4oz features.
  • 100% electrical test plus impedance check on signal layers.
  • Thermal shock, IST and solderability report available for each lot on request.

Working With Our Engineers

Heavy copper changes everything downstream: trace width, dielectric spacing, panelization and assembly reflow profile. Send your Gerber, copper weight per layer and thermal target and we return a manufacturability review with a corrected stackup within one business day. Copper weight from 2oz to 6oz and thickness from 1.6mm to 6.0mm are available on the same production line.

Ordering and Delivery

Minimum order 5 square meters, USD 12-55 per piece depending on layer count and copper weight. Monthly capacity 15000 square meters. Prototype lead time 5-7 working days, volume orders 12-18 working days. Payment by T/T, L/C or Western Union.

Need samples? Tell us your current rating, working temperature and enclosure space, and we will propose a copper build for your controller.

Send your inquiry
Please send us your request and we will reply to you as soon as possible.
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