Product Details
Place of Origin: China
Brand Name: Kingtech
Certification: ISO 9001:2015, UL, RoHS
Model Number: MLB-24L-BP
Payment & Shipping Terms
Minimum Order Quantity: 5 Square Meters
Price: USD 8-40 / Piece
Packaging Details: Vacuum packed with desiccant and humidity indicator, ESD bag, export-grade carton with edge protection
Delivery Time: 3-5 working days for prototype, 10-15 working days for batch orders
Payment Terms: T/T, L/C, Western Union
Supply Ability: 20000 Square Meters per Month
Layer Count: |
24L (2-48L Available) |
Back Drill Depth Control: |
0.15mm |
Aspect Ratio: |
20:1 |
Impedance Control: |
±5% |
Max. Board Thickness: |
6.0mm |
Min. Line Width/Space: |
0.05/0.05mm |
Min. Core Thickness: |
0.03mm |
Max. Panel Size: |
1000*600mm |
Base Material: |
FR4 TG170, High-Tg Laminate |
Surface Treatment: |
ENIG, Immersion Silver, OSP, HASL, Hard Gold |
Layer Misalignment: |
0.1mm |
Application: |
Server Backplane, Data Center Switch, Storage Controller |
Layer Count: |
24L (2-48L Available) |
Back Drill Depth Control: |
0.15mm |
Aspect Ratio: |
20:1 |
Impedance Control: |
±5% |
Max. Board Thickness: |
6.0mm |
Min. Line Width/Space: |
0.05/0.05mm |
Min. Core Thickness: |
0.03mm |
Max. Panel Size: |
1000*600mm |
Base Material: |
FR4 TG170, High-Tg Laminate |
Surface Treatment: |
ENIG, Immersion Silver, OSP, HASL, Hard Gold |
Layer Misalignment: |
0.1mm |
Application: |
Server Backplane, Data Center Switch, Storage Controller |
This 24 layer multilayer PCB board is engineered for server backplanes and data center switches where routing density, signal integrity and long-term reliability decide whether a platform ships on schedule. A 0.15mm back drill removes unused via stubs, so 25Gbps and 56Gbps channels keep their eye margin instead of paying for stub resonance.
| Parameter | Specification |
|---|---|
| Layer Count | 24L standard, 2-48L on request |
| Back Drill | 0.15mm depth control |
| Aspect Ratio | 20:1 |
| Impedance Control | plus/minus 5% |
| Max. Board Thickness | 6.0mm |
| Min. Line Width/Space | 0.05/0.05mm |
| Min. Core Thickness | 0.03mm |
| Layer Misalignment | 0.1mm |
| Max. Panel Size | 1000*600mm |
| Surface Treatment | ENIG, Immersion Silver, OSP, HASL, Hard Gold, ENIG+OSP |
| Base Material | FR4 TG170 / high-Tg laminate |
Rack-mount servers, storage controllers, 100G/400G switch line cards, telecom shelf backplanes and industrial computing platforms that must survive 10 to 15 years of continuous duty.
Send your Gerber and stackup file and our engineering team returns a DFM report within 24 hours. We support impedance target adjustments, material substitution for cost reduction, panelization for assembly, and controlled stackups locked to your layer assignment. Prototype quantities start from 5 square meters with 3 to 5 working days lead time.
Minimum order quantity 5 square meters. Payment by T/T, L/C or Western Union. Monthly capacity 20000 square meters. Boards are vacuum packed with desiccant, sealed in ESD bags and shipped in export-grade cartons with edge protection.
Request a quote: share your layer count, board thickness, surface finish and annual volume, and we will reply within one business day.