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HONGKONG KINGTECH PCB SOLUTION LIMITED
HONGKONG KINGTECH PCB SOLUTION LIMITED
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24 Layer Multilayer PCB Board 20:1 Aspect Ratio 0.15mm Back Drill For Server Backplane

Product Details

Place of Origin: China

Brand Name: Kingtech

Certification: ISO 9001:2015, UL, RoHS

Model Number: MLB-24L-BP

Payment & Shipping Terms

Minimum Order Quantity: 5 Square Meters

Price: USD 8-40 / Piece

Packaging Details: Vacuum packed with desiccant and humidity indicator, ESD bag, export-grade carton with edge protection

Delivery Time: 3-5 working days for prototype, 10-15 working days for batch orders

Payment Terms: T/T, L/C, Western Union

Supply Ability: 20000 Square Meters per Month

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Specifications
Highlight:

24 layer multilayer PCB board

,

20:1 aspect ratio PCB

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0.15mm back drill PCB

Layer Count:
24L (2-48L Available)
Back Drill Depth Control:
0.15mm
Aspect Ratio:
20:1
Impedance Control:
±5%
Max. Board Thickness:
6.0mm
Min. Line Width/Space:
0.05/0.05mm
Min. Core Thickness:
0.03mm
Max. Panel Size:
1000*600mm
Base Material:
FR4 TG170, High-Tg Laminate
Surface Treatment:
ENIG, Immersion Silver, OSP, HASL, Hard Gold
Layer Misalignment:
0.1mm
Application:
Server Backplane, Data Center Switch, Storage Controller
Layer Count:
24L (2-48L Available)
Back Drill Depth Control:
0.15mm
Aspect Ratio:
20:1
Impedance Control:
±5%
Max. Board Thickness:
6.0mm
Min. Line Width/Space:
0.05/0.05mm
Min. Core Thickness:
0.03mm
Max. Panel Size:
1000*600mm
Base Material:
FR4 TG170, High-Tg Laminate
Surface Treatment:
ENIG, Immersion Silver, OSP, HASL, Hard Gold
Layer Misalignment:
0.1mm
Application:
Server Backplane, Data Center Switch, Storage Controller
Description
24 Layer Multilayer PCB Board 20:1 Aspect Ratio 0.15mm Back Drill For Server Backplane

24 Layer Multilayer PCB Board for Server Backplane

This 24 layer multilayer PCB board is engineered for server backplanes and data center switches where routing density, signal integrity and long-term reliability decide whether a platform ships on schedule. A 0.15mm back drill removes unused via stubs, so 25Gbps and 56Gbps channels keep their eye margin instead of paying for stub resonance.

Designed Around Signal Integrity

  • 24 layer stackup with symmetrical build-up, available from 2L to 48L for platform scaling.
  • 0.15mm back drill for stub-free through vias on high-speed differential pairs.
  • Impedance control plus/minus 5% on single-ended and differential traces, verified by TDR coupon.
  • 20:1 aspect ratio for thick backplanes with press-fit connector holes.
  • 0.05/0.05mm line width and space plus 0.14mm inner layer pads for dense BGA fan-out.

Technical Parameters

ParameterSpecification
Layer Count24L standard, 2-48L on request
Back Drill0.15mm depth control
Aspect Ratio20:1
Impedance Controlplus/minus 5%
Max. Board Thickness6.0mm
Min. Line Width/Space0.05/0.05mm
Min. Core Thickness0.03mm
Layer Misalignment0.1mm
Max. Panel Size1000*600mm
Surface TreatmentENIG, Immersion Silver, OSP, HASL, Hard Gold, ENIG+OSP
Base MaterialFR4 TG170 / high-Tg laminate

Where It Is Used

Rack-mount servers, storage controllers, 100G/400G switch line cards, telecom shelf backplanes and industrial computing platforms that must survive 10 to 15 years of continuous duty.

Quality Gates Before Shipping

  • Impedance coupon and TDR report attached to every lot.
  • Flying probe and AOI on 100% of panels, IPC-A-600 Class 3 acceptance.
  • Thermal stress and IST testing on the 24 layer stackup.
  • Cross-section analysis for back drill depth and registration.

Customization and Engineering Support

Send your Gerber and stackup file and our engineering team returns a DFM report within 24 hours. We support impedance target adjustments, material substitution for cost reduction, panelization for assembly, and controlled stackups locked to your layer assignment. Prototype quantities start from 5 square meters with 3 to 5 working days lead time.

Ordering Information

Minimum order quantity 5 square meters. Payment by T/T, L/C or Western Union. Monthly capacity 20000 square meters. Boards are vacuum packed with desiccant, sealed in ESD bags and shipped in export-grade cartons with edge protection.

Request a quote: share your layer count, board thickness, surface finish and annual volume, and we will reply within one business day.

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