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HONGKONG KINGTECH PCB SOLUTION LIMITED
HONGKONG KINGTECH PCB SOLUTION LIMITED
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High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control

Product Details

Place of Origin: China

Brand Name: Kingtech

Certification: GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000

Payment & Shipping Terms

Minimum Order Quantity: 1pcs

Price: By quote

Packaging Details: Vacuum packing

Delivery Time: 2-7days

Payment Terms: By quote

Supply Ability: 500000 SQM per month

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Specifications
Highlight:

hdi pcb board red

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red consumer electronics pcba

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industrial control hdi pcb board

Blind Hole Aspect Ratio:
1:1
Min. Line Widthe/space:
0.04mm/ 0.04mm
Min. Laser Drill Hole Size:
0.07mm
Max. Board Size:
540*620
BGA Pitch:
0.3mm
Board Thickness:
0.2-3.2mm
Min. Mechanical Drill Hole Size:
0.1mm
Copper Thickness:
1/3-8
Blind Hole Aspect Ratio:
1:1
Min. Line Widthe/space:
0.04mm/ 0.04mm
Min. Laser Drill Hole Size:
0.07mm
Max. Board Size:
540*620
BGA Pitch:
0.3mm
Board Thickness:
0.2-3.2mm
Min. Mechanical Drill Hole Size:
0.1mm
Copper Thickness:
1/3-8
Description
High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control
HDI PCB & PCBA Manufacturing for Industrial Control Applications
We provide comprehensive HDI PCB and PCBA manufacturing solutions specifically designed for industrial control applications. Our services support automation systems, embedded control boards, and high-reliability industrial electronics requiring compact layouts, fine-pitch components, and stable performance in demanding environments.
Key Technical Capabilities
Product Name: HDI PCB Board
Misalignment of layers: +/- 0.06 mm
Blind Hole Aspect Ratio: 1:1
Impedance Control: ±8%
Board Thickness: 0.2-3.2 mm
Min. Mechanical Drill Hole size: 0.1 mm
Detailed Technical Parameters
Parameter Specification
Product Name HDI PCB Board
Application HDI Consumer Electronics
Technology HDI PCB Board Technology
Blind Hole Aspect Ratio 1:1
Max. Board Size 540*620 mm
Min. Laser Drill Hole Size 0.07 mm
Impedance Control ±8%
BGA Pitch 0.3 mm
Misalignment of Layers +/- 0.06 mm
Warpage ≤0.4%
Copper Thickness 1/3-8 oz
Min. Line Width/Space 0.04 mm/ 0.04 mm
Vias Aspect Ratio 16:1
Why Choose Our OEM PCB Boards?
  • Direct PCB Manufacturer - no trading risk
  • Fast Turnaround for prototypes and NPI projects
  • Strict Quality Control (ISO / IATF / AS standards)
  • Engineering Support for DFM & stack-up
  • Stable Mass Production Capability
  • Export-oriented factory serving EU & US markets
High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control 0 High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control 1
Application Areas
This HDI PCB solution is commonly implemented in:
  • Industrial automation control systems
  • Communication & networking equipment
  • Embedded computing modules
  • Power management & signal processing boards
If your design involves high component density, fine-pitch BGAs, or thermal challenges, this solution provides optimal performance and reliability.
Certifications & Compliance
  • UL certified PCB manufacturing
  • ISO 9001 quality management system
  • IATF 16949 compliant process (automotive projects)
Certificates and test reports can be provided upon request.
High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control 2
FAQ - Prototype & NPI Focused
Q: What is the minimum order quantity for HDI PCB prototypes?
A: We support MOQ from 1 piece for HDI PCB prototype orders, suitable for NPI and design verification stages.
Q: Can you support impedance control for HDI multilayer PCBs?
A: Yes. We provide controlled impedance HDI PCB manufacturing, typically within ±10% tolerance, based on customer stack-up and test coupons. Impedance test reports can be provided upon request.
Q: Do you assist with HDI stack-up and design optimization?
A: Yes. For ODM and custom HDI projects, we can assist with stack-up planning, material selection (high Tg), BGA fanout feasibility, and DFM review to improve manufacturability and yield.
Q: What is the typical lead time for HDI PCB orders?
A: HDI prototypes: 3-7 working days
Low-volume production: depends on layer count and complexity
Mass production: scheduled based on confirmed specifications and quantity
Q: What high Tg materials do you use for HDI PCBs?
A: We work with high Tg FR-4 materials (Tg ≥170°C) from qualified suppliers. Specific material brands can be selected according to thermal and reliability specifications.
Q: Can you provide UL or quality certificates?
A: Yes. Our HDI PCB manufacturing process is UL certified, and we operate under ISO 9001 and IATF 16949 compliant processes. Certificates are available upon request.
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