Product Details
Place of Origin: China
Brand Name: Kingtech
Certification: GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000
Payment & Shipping Terms
Minimum Order Quantity: 1pcs
Price: By quote
Packaging Details: Vacuum packing
Delivery Time: 2-7days
Payment Terms: By quote
Supply Ability: 500000 SQM per month
Blind Hole Aspect Ratio: |
1:1 |
Min. Line Widthe/space: |
0.04mm/ 0.04mm |
Min. Laser Drill Hole Size: |
0.07mm |
Max. Board Size: |
540*620 |
BGA Pitch: |
0.3mm |
Board Thickness: |
0.2-3.2mm |
Min. Mechanical Drill Hole Size: |
0.1mm |
Copper Thickness: |
1/3-8 |
Blind Hole Aspect Ratio: |
1:1 |
Min. Line Widthe/space: |
0.04mm/ 0.04mm |
Min. Laser Drill Hole Size: |
0.07mm |
Max. Board Size: |
540*620 |
BGA Pitch: |
0.3mm |
Board Thickness: |
0.2-3.2mm |
Min. Mechanical Drill Hole Size: |
0.1mm |
Copper Thickness: |
1/3-8 |
| Parameter | Specification |
|---|---|
| Product Name | HDI PCB Board |
| Application | HDI Consumer Electronics |
| Technology | HDI PCB Board Technology |
| Blind Hole Aspect Ratio | 1:1 |
| Max. Board Size | 540*620 mm |
| Min. Laser Drill Hole Size | 0.07 mm |
| Impedance Control | ±8% |
| BGA Pitch | 0.3 mm |
| Misalignment of Layers | +/- 0.06 mm |
| Warpage | ≤0.4% |
| Copper Thickness | 1/3-8 oz |
| Min. Line Width/Space | 0.04 mm/ 0.04 mm |
| Vias Aspect Ratio | 16:1 |