ODM HDI PCB Manufacturing – High-Tg Multilayer Boards for High-Density Electronics (UL Certified)
Product Overview
This ODM HDI PCB is engineered for high-density, multilayer electronic applications requiring stable thermal performance, fine-pitch routing, and reliable signal integrity. Utilizing high-Tg laminate materials and controlled HDI processes, the board maintains mechanical and electrical stability under continuous thermal stress. Ideal for industrial control systems, communication equipment, and advanced embedded systems. We support complete production from prototype to volume manufacturing, ensuring design consistency throughout all stages.
Key Technical Capabilities
- High-Tg FR-4 material options (Tg ≥ 170°C)
- Multilayer HDI structure with microvias & blind/buried vias
- Fine line/space capability down to 0.05/0.05 mm
- Laser microvias ≥ 0.07 mm
- Controlled impedance with tolerance ±10% or better
- BGA pitch support down to 0.3 mm
- UL certified PCB manufacturing process
Typical Specifications
| Product Attribute |
Parameters |
| Layer Count |
4 - 20+ layers |
| Board Thickness |
0.2 - 3.2 mm |
| Copper Thickness |
0.5 - 2 oz (custom available) |
| Min Hole Size |
0.15 mm (mechanical) |
| Surface Finish |
ENIG / OSP / HASL / Immersion Silver |
| Standards |
IPC-6012, IPC-A-600 |
| Certification |
UL, ISO 9001, IATF 16949 (process) |
Why Choose Our OEM PCB Boards?
- ✔Direct PCB Manufacturer – no trading risk
- ✔Fast Turnaround for prototypes and NPI projects
- ✔Strict Quality Control (ISO / IATF / AS standards)
- ✔Engineering Support for DFM & stack-up
- ✔Stable Mass Production Capability
- ✔Export-oriented factory serving EU & US markets
Application Areas
This HDI PCB solution is commonly implemented in:
- Industrial automation control systems
- Communication & networking equipment
- Embedded computing modules
- Power management & signal processing boards
If your design involves high component density, fine-pitch BGAs, or thermal challenges, this solution provides optimal performance and reliability.
Certifications & Compliance
- UL certified PCB manufacturing
- ISO 9001 quality management system
- IATF 16949 compliant process (automotive projects)
Certificates and test reports can be provided upon request.
FAQ - HDI PCB Engineering & Ordering
What is the minimum order quantity for HDI PCB prototypes?
We support MOQ from 1 piece for HDI PCB prototype orders, suitable for NPI and design verification stages.
Can you support impedance control for HDI multilayer PCBs?
Yes. We provide controlled impedance HDI PCB manufacturing, typically within ±10% tolerance, based on customer stack-up and test coupons. Impedance test reports can be provided upon request.
Do you assist with HDI stack-up and design optimization?
Yes. For ODM and custom HDI projects, we can assist with stack-up planning, material selection (high Tg), BGA fanout feasibility, and DFM review to improve manufacturability and yield.
What is the typical lead time for HDI PCB orders?
HDI prototypes: 3-7 working days
Low-volume production: depends on layer count and complexity
Mass production: scheduled based on confirmed specifications and quantity
What high Tg materials do you use for HDI PCBs?
We work with high Tg FR-4 materials (Tg ≥170°C) from qualified suppliers. Specific material brands can be selected according to thermal and reliability specifications.
Can you provide UL or quality certificates?
Yes. Our HDI PCB manufacturing process is UL certified, and we operate under ISO 9001 and IATF 16949 compliant processes. Certificates are available upon request.
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