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LCM products, double sided, BGA pads, gold plating
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical
components are mounted directly onto the surface of a printed circuit board (PCB).An electrical component
mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely
replaced the through-hole technology construction method of fitting components, in large part because SMT
allows for increased manufacturing automation which reduces cost and improves quality. It also allows for
more components to fit on a given area of substrate. Both technologies can be used on the same board, with
the through-hole technology often used for components not suitable for surface mounting such as large
transformers and heat-sinked power semiconductors.
| Types | THD((Thru-Hole Device) |
| SMT(Surface-Mount Technology) | |
| SMT &THD mixed | |
| 2 sided SMT and THD assembly | |
| Parts /Components | Passives parts,smallest size 0201 |
| Fine pitch to 8 Mils | |
| BGA,uBGA,QFN,POP, Press fit and Leadless chips |
|
| Connectors and terminals | |
| Component Package | Reels |
| Cut tape | |
| Tube and Tray | |
| Loose parts and bulk |
